India can leverage advanced packaging to become a global leader in semiconductor manufacturing, shifting from traditional system-on-chip to system-on-package designs. This approach offers a lower-capital pathway into the industry, building on India's existing chip design strengths. The author proposes a national innovation ecosystem with co-development centers and a pilot line, alongside robust workforce development. This strategy will foster technological self-reliance, economic growth, and national security, making India a preferred destination for advanced packaging, requiring sustained commitment and strategic investment and partnerships.